WIRING BOARD AND MANUFACTURING METHOD THEREOF

To provide a flexible wiring board and a manufacturing method thereof.SOLUTION: A wiring board includes a stretchable base material, a first silica aerogel layer provided on the stretchable substrate, a liquid metal layer provided on the first silica aerogel layer, and a stretchable insulation mater...

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Bibliographische Detailangaben
1. Verfasser:	SAKAGUCHI SHIGEKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide a flexible wiring board and a manufacturing method thereof.SOLUTION: A wiring board includes a stretchable base material, a first silica aerogel layer provided on the stretchable substrate, a liquid metal layer provided on the first silica aerogel layer, and a stretchable insulation material sealing the first silica aerogel layer and the liquid metal layer.SELECTED DRAWING: Figure 7 【課題】柔軟性のある配線基板およびその製造方法を提供すること。【解決手段】伸縮性基材と、伸縮性基材上に設けられた第１のシリカエアロゲル層と、第１のシリカエアロゲル層上に設けられた液体金属層と、第１のシリカエアロゲル層と液体金属層を封止する伸縮性絶縁材とを備える、配線基板。【選択図】図７