METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC COMPONENT DEVICE

To provide a method for manufacturing an electronic component device capable of improving a yield even when collectively manufacturing a plurality of electronic component devices, and the electronic component device manufactured by the method.SOLUTION: A method for manufacturing an electronic compon...

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Hauptverfasser:	SUZUKI NAOYA, ONOZEKI HITOSHI, TAKAHASHI HIROSHI, FUJIMOTO DAISUKE, KOSEKI YUTA, YAMADA KUNPEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a method for manufacturing an electronic component device capable of improving a yield even when collectively manufacturing a plurality of electronic component devices, and the electronic component device manufactured by the method.SOLUTION: A method for manufacturing an electronic component device includes a heating step of joining an electronic component and a substrate via a plurality of bumps by heating the electronic component by a heating member via a buffer sheet including a releasing layer on one or both surfaces in a state in which the electronic component and the substrate are in contact with each other via the plurality of bumps.SELECTED DRAWING: None 【課題】複数の電子部品装置を一括して製造する場合であっても歩留まりを向上させることが可能な電子部品装置の製造方法、及びその製造方法により製造される電子部品装置を提供する。【解決手段】電子部品と基板とが複数のバンプを介して接触した状態で、片面又は両面に離型層を有する緩衝シートを介して加熱用部材により電子部品を加熱することによって、電子部品と基板とをバンプを介して接合する加熱工程を有する、電子部品装置の製造方法。【選択図】なし