SEMICONDUCTOR MODULE AND TEMPERATURE MEASUREMENT METHOD OF SEMICONDUCTOR MODULE
To provide a semiconductor module capable of accurately measuring the temperature of a semiconductor chip and its temperature measurement method.SOLUTION: A semiconductor module 10 having a semiconductor chip 3, a lead frame 4 bonded to the semiconductor chip 3, and a sealing resin 6 encapsulating t...
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| creator | TANIMURA TOSHIKI HAYAKAWA SEIICHI TAKEUCHI YUJIRO |
| description | To provide a semiconductor module capable of accurately measuring the temperature of a semiconductor chip and its temperature measurement method.SOLUTION: A semiconductor module 10 having a semiconductor chip 3, a lead frame 4 bonded to the semiconductor chip 3, and a sealing resin 6 encapsulating the semiconductor chip 3 and the lead frame 4, comprises a temperature measurement window 5 that exposes the region of the lead frame 4 overlapping the semiconductor chip 3 from the sealing resin 6. Using this semiconductor module 10, the temperature is measured by measuring the intensity of infrared radiation emitted from the lead frame 4 through the temperature measurement window 5.SELECTED DRAWING: Figure 3
【課題】半導体チップの温度を正確に計測できる半導体モジュールとその温度計測方法を提供する。【解決手段】半導体チップ３と、半導体チップ３に接合されたリードフレーム４と、半導体チップ３とリードフレーム４とを封止する封止樹脂６とを有する半導体モジュール１０において、リードフレーム４の半導体チップ３と重なる領域を封止樹脂６から露出させる温度計測窓５を有する。この半導体モジュール１０を用い、温度計測窓５を介してリードフレーム４から放射される赤外線強度を測定して温度計測する。【選択図】図３ |
| format | Patent |
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【課題】半導体チップの温度を正確に計測できる半導体モジュールとその温度計測方法を提供する。【解決手段】半導体チップ３と、半導体チップ３に接合されたリードフレーム４と、半導体チップ３とリードフレーム４とを封止する封止樹脂６とを有する半導体モジュール１０において、リードフレーム４の半導体チップ３と重なる領域を封止樹脂６から露出させる温度計測窓５を有する。この半導体モジュール１０を用い、温度計測窓５を介してリードフレーム４から放射される赤外線強度を測定して温度計測する。【選択図】図３</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231206&DB=EPODOC&CC=JP&NR=2023172268A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231206&DB=EPODOC&CC=JP&NR=2023172268A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANIMURA TOSHIKI</creatorcontrib><creatorcontrib>HAYAKAWA SEIICHI</creatorcontrib><creatorcontrib>TAKEUCHI YUJIRO</creatorcontrib><title>SEMICONDUCTOR MODULE AND TEMPERATURE MEASUREMENT METHOD OF SEMICONDUCTOR MODULE</title><description>To provide a semiconductor module capable of accurately measuring the temperature of a semiconductor chip and its temperature measurement method.SOLUTION: A semiconductor module 10 having a semiconductor chip 3, a lead frame 4 bonded to the semiconductor chip 3, and a sealing resin 6 encapsulating the semiconductor chip 3 and the lead frame 4, comprises a temperature measurement window 5 that exposes the region of the lead frame 4 overlapping the semiconductor chip 3 from the sealing resin 6. Using this semiconductor module 10, the temperature is measured by measuring the intensity of infrared radiation emitted from the lead frame 4 through the temperature measurement window 5.SELECTED DRAWING: Figure 3
【課題】半導体チップの温度を正確に計測できる半導体モジュールとその温度計測方法を提供する。【解決手段】半導体チップ３と、半導体チップ３に接合されたリードフレーム４と、半導体チップ３とリードフレーム４とを封止する封止樹脂６とを有する半導体モジュール１０において、リードフレーム４の半導体チップ３と重なる領域を封止樹脂６から露出させる温度計測窓５を有する。この半導体モジュール１０を用い、温度計測窓５を介してリードフレーム４から放射される赤外線強度を測定して温度計測する。【選択図】図３</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAPdvX1dPb3cwl1DvEPUvD1dwn1cVVw9HNRCHH1DXANcgwJDXJV8HV1DAbSvq5-IUB2iIe_i4K_mwI2rTwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN4rwMjAyNjQ3MjIzMLRmChFAOExL7M</recordid><startdate>20231206</startdate><enddate>20231206</enddate><creator>TANIMURA TOSHIKI</creator><creator>HAYAKAWA SEIICHI</creator><creator>TAKEUCHI YUJIRO</creator><scope>EVB</scope></search><sort><creationdate>20231206</creationdate><title>SEMICONDUCTOR MODULE AND TEMPERATURE MEASUREMENT METHOD OF SEMICONDUCTOR MODULE</title><author>TANIMURA TOSHIKI ; HAYAKAWA SEIICHI ; TAKEUCHI YUJIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023172268A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TANIMURA TOSHIKI</creatorcontrib><creatorcontrib>HAYAKAWA SEIICHI</creatorcontrib><creatorcontrib>TAKEUCHI YUJIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANIMURA TOSHIKI</au><au>HAYAKAWA SEIICHI</au><au>TAKEUCHI YUJIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR MODULE AND TEMPERATURE MEASUREMENT METHOD OF SEMICONDUCTOR MODULE</title><date>2023-12-06</date><risdate>2023</risdate><abstract>To provide a semiconductor module capable of accurately measuring the temperature of a semiconductor chip and its temperature measurement method.SOLUTION: A semiconductor module 10 having a semiconductor chip 3, a lead frame 4 bonded to the semiconductor chip 3, and a sealing resin 6 encapsulating the semiconductor chip 3 and the lead frame 4, comprises a temperature measurement window 5 that exposes the region of the lead frame 4 overlapping the semiconductor chip 3 from the sealing resin 6. Using this semiconductor module 10, the temperature is measured by measuring the intensity of infrared radiation emitted from the lead frame 4 through the temperature measurement window 5.SELECTED DRAWING: Figure 3
【課題】半導体チップの温度を正確に計測できる半導体モジュールとその温度計測方法を提供する。【解決手段】半導体チップ３と、半導体チップ３に接合されたリードフレーム４と、半導体チップ３とリードフレーム４とを封止する封止樹脂６とを有する半導体モジュール１０において、リードフレーム４の半導体チップ３と重なる領域を封止樹脂６から露出させる温度計測窓５を有する。この半導体モジュール１０を用い、温度計測窓５を介してリードフレーム４から放射される赤外線強度を測定して温度計測する。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR MODULE AND TEMPERATURE MEASUREMENT METHOD OF SEMICONDUCTOR MODULE |
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