SEMICONDUCTOR MODULE AND TEMPERATURE MEASUREMENT METHOD OF SEMICONDUCTOR MODULE

To provide a semiconductor module capable of accurately measuring the temperature of a semiconductor chip and its temperature measurement method.SOLUTION: A semiconductor module 10 having a semiconductor chip 3, a lead frame 4 bonded to the semiconductor chip 3, and a sealing resin 6 encapsulating t...

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Bibliographische Detailangaben
Hauptverfasser:	TANIMURA TOSHIKI, HAYAKAWA SEIICHI, TAKEUCHI YUJIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a semiconductor module capable of accurately measuring the temperature of a semiconductor chip and its temperature measurement method.SOLUTION: A semiconductor module 10 having a semiconductor chip 3, a lead frame 4 bonded to the semiconductor chip 3, and a sealing resin 6 encapsulating the semiconductor chip 3 and the lead frame 4, comprises a temperature measurement window 5 that exposes the region of the lead frame 4 overlapping the semiconductor chip 3 from the sealing resin 6. Using this semiconductor module 10, the temperature is measured by measuring the intensity of infrared radiation emitted from the lead frame 4 through the temperature measurement window 5.SELECTED DRAWING: Figure 3 【課題】半導体チップの温度を正確に計測できる半導体モジュールとその温度計測方法を提供する。【解決手段】半導体チップ３と、半導体チップ３に接合されたリードフレーム４と、半導体チップ３とリードフレーム４とを封止する封止樹脂６とを有する半導体モジュール１０において、リードフレーム４の半導体チップ３と重なる領域を封止樹脂６から露出させる温度計測窓５を有する。この半導体モジュール１０を用い、温度計測窓５を介してリードフレーム４から放射される赤外線強度を測定して温度計測する。【選択図】図３