CLEAVAGE SYSTEM WITH SPRING MEMBER FOR CLEAVING SEMICONDUCTOR STRUCTURE, AND METHOD FOR CLEAVING STRUCTURE
To provide a novel cleavage system that results in cleavage structures with improved surface roughness characteristics and a method for cleaving that involves the use of such a cleavage system.SOLUTION: A cleavage system 5 is a system for cleaving a semiconductor structure and includes cleavage arms...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a novel cleavage system that results in cleavage structures with improved surface roughness characteristics and a method for cleaving that involves the use of such a cleavage system.SOLUTION: A cleavage system 5 is a system for cleaving a semiconductor structure and includes cleavage arms 9 that are movable from a start position to an elevated position where cleavage stress is applied to the semiconductor structure. A spring member 33 stores energy as the cleavage arm is raised, with the stored spring energy causing the structure to cleave into two parts at the start of cleavage across the structure.SELECTED DRAWING: Figure 1
【課題】改善された表面粗さ特性を有する劈開構造をもたらす新しい劈開システム及びそのような劈開システムの使用を伴う劈開方法を提供する。【解決手段】劈開システム5は、半導体構造を劈開するためのシステムであり、開始位置から、劈開応力が半導体構造に加えられる上昇位置まで移動可能である劈開アーム9を含む。ばね部材33は、構造を横切る劈開の開始時に、蓄えられたばねエネルギーが構造を2つの部分に劈開させる状態で、劈開アームが上昇されるときにエネルギーを貯蔵する。【選択図】図1 |
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