SUBSTRATE PROCESSING COMPOSITION AND SUBSTRATE PROCESSING METHOD USING THE SAME

To provide a substrate processing composition and a substrate processing method which can suppress contamination due to metal during an edge rinsing step or a subsequent substrate cleaning step in a lithography process using a metal-containing resist composition and the resulting deterioration of el...

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Bibliographische Detailangaben
Hauptverfasser:	YANG JINSEOK, HAH JUNGHWAN, JO SUYEON
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a substrate processing composition and a substrate processing method which can suppress contamination due to metal during an edge rinsing step or a subsequent substrate cleaning step in a lithography process using a metal-containing resist composition and the resulting deterioration of electrical characteristics of a semiconductor device, and also achieve improvement in terms of the influence on an underlying film or the stability over time (solubility).SOLUTION: There is provided a substrate processing composition which is a composition for processing a substrate coated with a metal-containing resist composition. The substrate processing composition includes an organic solvent, and additives, and the additives include an organic fluoroacid and an organic sulfonic acid.SELECTED DRAWING: Figure 1 【課題】金属含有レジスト組成物を用いるリソグラフィ工程において、エッジリンスステップやその後の基板洗浄処理ステップの間に金属による汚染およびそれによる半導体素子の電気的特性劣化を抑制できながらも、下地膜への影響や経時安定性(溶解度)側面でも改善された基板処理組成物および基板処理方法を提供する。【解決手段】本発明の基板処理組成物は、金属含有レジスト組成物が塗布された基板を処理するための組成物であって、有機溶剤と、添加剤とを含み、添加剤は、有機フッ素酸および有機スルホン酸を含む。【選択図】図１