ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT MOUNTING METHOD

To provide an electronic component mounting device capable of cooling an optical system of an imaging unit to a desired degree of cooling, suppressing occurrence of recognition deviation due to thermal deformation of the optical system of the imaging unit, and realizing stable component mounting.SOL...

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Bibliographische Detailangaben
Hauptverfasser:	HAMAHIRA DAI, EMOTO YASUHIRO, KUBOTA MASAHIRO, KUSAKABE MICHINORI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide an electronic component mounting device capable of cooling an optical system of an imaging unit to a desired degree of cooling, suppressing occurrence of recognition deviation due to thermal deformation of the optical system of the imaging unit, and realizing stable component mounting.SOLUTION: An electronic component mounting device that uses a component mounting head to mount a component on a substrate that is heated and supported by a substrate support unit includes an imaging unit arranged above the substrate support unit and configured to image an imaging target, an optical unit for the imaging unit to recognize an imaging target, and a cooling unit that cools the optical unit under a predetermined cooling condition.SELECTED DRAWING: Figure 4 【課題】撮像ユニットの光学系を所望の冷却具合で冷却でき、撮像ユニットの光学系の熱変形により認識ずれが発生することを抑制でき、安定した部品実装を実現できる電子部品搭載装置を提供する。【解決手段】電子部品搭載装置は、基板支持ユニットによって加熱しながら支持される基板に対して、部品搭載ヘッドによって部品を搭載する電子部品搭載装置であって、前記基板支持ユニットの上方に配置され、撮像対象を撮像する撮像ユニットと、撮像ユニットが撮像対象を認識するための光学ユニットと、所定の冷却条件で光学ユニットを冷却する冷却ユニットと、を有する。【選択図】図４