RESIN COMPOSITION

To provide a resin composition that can yield a cured product, which has a low dielectric loss tangent and can suppress a decrease in adhesion with a conductor layer after HAST testing, and a cured product from the resin composition, a sheet-like laminate material, a resin sheet, a printed wiring bo...

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Bibliographische Detailangaben
1. Verfasser:	OISHI RYOHEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a resin composition that can yield a cured product, which has a low dielectric loss tangent and can suppress a decrease in adhesion with a conductor layer after HAST testing, and a cured product from the resin composition, a sheet-like laminate material, a resin sheet, a printed wiring board, and a semiconductor device.SOLUTION: A resin composition contains (A) talc, (B) an epoxy resin, and (C) an active ester compound.SELECTED DRAWING: None 【課題】誘電正接が低く、且つ、ＨＡＳＴ試験後の導体層との密着性の低下を抑制し得る硬化物を得ることができる樹脂組成物、並びに、当該樹脂組成物を用いて得られる硬化物、シート状積層材料、樹脂シート、プリント配線板、及び半導体装置を提供する。【解決手段】（Ａ）タルク、（Ｂ）エポキシ樹脂、及び（Ｃ）活性エステル化合物を含む樹脂組成物。【選択図】なし