FILM DEPOSITION APPARATUS, METHOD FOR DEPOSITING FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

To provide a technology that suppresses deviation between a desired film deposition position in a substrate and an actual film deposition position.SOLUTION: A film deposition apparatus includes: alignment means for positioning a mask to a substrate using a substrate mark provided in the substrate an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WATABE ARATA, TAMURA HIROYUKI, KOKETSU NAOYUKI, KANAI RYOTA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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