FILM DEPOSITION APPARATUS, METHOD FOR DEPOSITING FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

To provide a technology that suppresses deviation between a desired film deposition position in a substrate and an actual film deposition position.SOLUTION: A film deposition apparatus includes: alignment means for positioning a mask to a substrate using a substrate mark provided in the substrate an...

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Bibliographische Detailangaben
Hauptverfasser:	WATABE ARATA, TAMURA HIROYUKI, KOKETSU NAOYUKI, KANAI RYOTA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a technology that suppresses deviation between a desired film deposition position in a substrate and an actual film deposition position.SOLUTION: A film deposition apparatus includes: alignment means for positioning a mask to a substrate using a substrate mark provided in the substrate and a mask mark provided in the mask; close adhesion means for bringing the positioned mask into close contact with the substrate; film deposition means for depositing a film on the substrate via the mask brought into close contact with the substrate; and imaging means for imaging at least one of the substrate mark and the mask mark after the start of film deposition by the film deposition means.SELECTED DRAWING: Figure 6 【課題】基板の所望の成膜位置と実際の成膜位置の間のずれを抑制する技術を提供する。【解決手段】基板に設けた基板マークと、マスクに設けたマスクマークとを用いて基板とマスクとの位置合わせを行うアライメント手段と、位置合わせされた基板とマスクとを密着させる密着手段と、基板に密着されたマスクを介して基板に成膜を行う成膜手段を有する成膜装置であって、成膜手段による成膜が開始された後に、基板マークおよびマスクマークの少なくとも一方を撮影する撮影手段を有する成膜装置を用いる。【選択図】図６