LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

To provide a light-emitting device that can improve the mounting property of the light-emitting device, while preventing a fault during manufacture, and provide a method for manufacturing the light-emitting device.SOLUTION: A light-emitting device has: an insulating substrate 10 that has a substantially rectangular upper surface shape, and has first notches 13A-C formed on one side face and second notches 15A-C formed on the other side face; first wiring electrodes 23A-C that cover areas of the edges of the first notches on an upper surface of the substrate and a lower surface of the substrate from inner surfaces of the first notches; second wiring electrodes 25A-C that are separated from the first wiring electrodes, and cover areas of the edges of the second notches on the upper surface of the substrate and the lower surface of the substrate from inner surfaces of the second notches; a first resin film 31 that covers the surface of the first wiring electrodes in a top view seen from a direction perpendicular to the upper surface of the substrate; a second resin film 32 that covers the surface of the second wiring electrodes in the top view; and light-emitting elements 41, 43, 45 that are arranged on the substrate and can be supplied with power by the first wiring electrodes and the second wiring electrodes.SELECTED DRAWING: Figure 1 【課題】製造時の不具合を抑制しつつ、発光装置の実装性を向上させることが可能な発光装置及び発光装置の製造方法を提供する。【解決手段】略矩形の上面形状を有し、一方の側面に形成された第１の切欠き１３Ａ－Ｃと、他方の側面に形成された第２の切欠き１５Ａ－Ｃを有する絶縁性の基板１０と、第１の切欠きの内側面から、基板の上面及び基板の下面の第１の切欠きの縁の領域を覆う第１の配線電極２３Ａ－Ｃと、第１の配線電極と離間しており、第２の切欠きの内側面から、基板の上面及び基板の下面の第２の切欠きの縁の領域を覆う第２の配線電極２５Ａ－Ｃと、基板の上面に垂直な方向から見た上面視において、第１の配線電極の表面を覆っている第１の樹脂膜３１と、上面視において、第２の配線電極の表面を覆っている第２の樹脂膜３２と、第１の配線電極及び第２の配線電極によって給電可能に基板上に配された発光素子４１、４３、４５と、を有する発光装置。【選択図】図１