PLATING APPARATUS
To provide an apparatus that accurately grasps a plating film thickness in real time during plating processing.SOLUTION: A plating apparatus includes: a plating tank for housing a plating solution; a substrate holder for holding a substrate; an anode arranged in the plating tank so as to face the su...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide an apparatus that accurately grasps a plating film thickness in real time during plating processing.SOLUTION: A plating apparatus includes: a plating tank for housing a plating solution; a substrate holder for holding a substrate; an anode arranged in the plating tank so as to face the substrate held by the substrate holder; a potential sensor arranged near the substrate held by the substrate holder and configured to measure a potential of the plating solution; and a state space model configured to estimate a current density flowing through an outer edge of the substrate using a state equation and an observation equation based on a measured value of the potential of the plating solution by the potential sensor.SELECTED DRAWING: Figure 5
【課題】めっき処理中に、リアルタイムで正確にめっき膜厚を把握する。【解決手段】めっき装置は、めっき液を収容するためのめっき槽と、基板を保持するための基板ホルダと、前記基板ホルダに保持された前記基板と対向するように前記めっき槽内に配置されたアノードと、前記基板ホルダに保持された前記基板の近傍に配置され、前記めっき液の電位を測定するように構成された電位センサと、前記電位センサによる前記めっき液の電位の測定値に基づいて、状態方程式および観測方程式を用いて前記基板の外縁部を流れる電流密度を推定するように構成された状態空間モデルと、を備える。【選択図】図５ |
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