COVER TAPE FOR PACKAGING CHIP-TYPE ELECTRONIC COMPONENT

To provide a cover tape for packaging a chip-type electronic component which can maintain a peel-off strength of a proper range, and suppresses reduction of transparency of the cover tape caused by blocking between a winding core part and a tape substrate, and generation of a crack in a seal layer.S...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHINODA MAKOTO, OBA SACHIKO, SHINOZAKI YOSUKE, NABETA KENJI, TAMURA KANAME, IKEDA KENTARO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING
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