GROUND PATH SYSTEM FOR PROVIDING SHORTER SYMMETRICAL GROUND PATH

To provide a chemical vapor deposition (CVD) chamber having a shorter symmetrical path for a radio frequency (RF) energy to propagate to the ground and having a ground path system that reduces the generation of parasitic plasma.SOLUTION: In a CVD chamber 100, a bottom bowl carrier 206 moves linearly...

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Hauptverfasser:	JASON M SCHALLER, DAVID BLAHNIK, SANJEEV BALUJA, TEJAS ULAVI, TUAN ANH NGUYEN, JUAN CARLOS ROCHA, AMIT KUMAR BANSAL, EDWARD P HAMMOND IV, MA JUN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a chemical vapor deposition (CVD) chamber having a shorter symmetrical path for a radio frequency (RF) energy to propagate to the ground and having a ground path system that reduces the generation of parasitic plasma.SOLUTION: In a CVD chamber 100, a bottom bowl carrier 206 moves linearly along a track 208 to move a bottom bowl 204 between a ground position and a transfer position. The bottom bowl 204 is coupled to the ground bowl 202 by a ground bowl conductor 210 and to the bottom 154 of a chamber body 102 via a bottom bowl conductor 214.SELECTED DRAWING: Figure 1A 【課題】高周波（ＲＦ）エネルギーが地面に伝搬するためのより短く対称的な経路を有し、寄生プラズマの生成を低減する接地経路システムを備えた化学気相堆積（ＣＶＤ）チャンバを提供する。【解決手段】ＣＶＤチャンバ１００において、底部ボウルキャリア２０６は、底部ボウル２０４を接地位置と移送位置の間で移動させるためにトラック２０８に沿って直線的に移動する。底部ボウル２０４は、接地ボウル導体２１０によって接地ボウル２０２に結合され、底部ボウル導体２１４を介してチャンバ本体１０２の底部１５４に結合されている。【選択図】図１Ａ