METAL PARTICLE AGGREGATE, CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THEM

To provide a fine metal particle aggregate having a uniform particle size distribution and having satisfactory transfer properties, a conductive film, a connection structure, and methods for producing them.SOLUTION: Each metal particle aggregate 1 is an aggregate of metal particles 2, has voids 3 in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TSUKAO SATOSHI, WATANABE KAZUMU, NODA DAIKI, HAYASHI NAOKI, NAMIKI HIDEJI, SHIRAIWA TOSHIKI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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