METAL PARTICLE AGGREGATE, CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THEM

To provide a fine metal particle aggregate having a uniform particle size distribution and having satisfactory transfer properties, a conductive film, a connection structure, and methods for producing them.SOLUTION: Each metal particle aggregate 1 is an aggregate of metal particles 2, has voids 3 in a surface, and when it is transferred to a conductive film 5 and is observed at a surface of the conductive film 5, 5% or more of the area of the aggregate is the voids 3 in plane view.SELECTED DRAWING: Figure 1 【課題】粒度分布が整っており、良好な転写特性を有する微小な金属粒子凝集体、導電性フィルム、接続構造体、およびこれらの製造方法を提供する。【解決手段】金属粒子凝集体１は、金属粒子２の凝集体であって、表面に空隙３を有し、導電性フィルム５に転写し、導電性フィルム５の表面で観察したときに、平面視において凝集体の面積の５％以上が空隙３である。【選択図】図１