METAL PARTICLE AGGREGATE, CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THEM
To provide a fine metal particle aggregate having a uniform particle size distribution and having satisfactory transfer properties, a conductive film, a connection structure, and methods for producing them.SOLUTION: Each metal particle aggregate 1 is an aggregate of metal particles 2, has voids 3 in...
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| creator | TSUKAO SATOSHI WATANABE KAZUMU NODA DAIKI HAYASHI NAOKI NAMIKI HIDEJI SHIRAIWA TOSHIKI |
| description | To provide a fine metal particle aggregate having a uniform particle size distribution and having satisfactory transfer properties, a conductive film, a connection structure, and methods for producing them.SOLUTION: Each metal particle aggregate 1 is an aggregate of metal particles 2, has voids 3 in a surface, and when it is transferred to a conductive film 5 and is observed at a surface of the conductive film 5, 5% or more of the area of the aggregate is the voids 3 in plane view.SELECTED DRAWING: Figure 1
【課題】粒度分布が整っており、良好な転写特性を有する微小な金属粒子凝集体、導電性フィルム、接続構造体、およびこれらの製造方法を提供する。【解決手段】金属粒子凝集体１は、金属粒子２の凝集体であって、表面に空隙３を有し、導電性フィルム５に転写し、導電性フィルム５の表面で観察したときに、平面視において凝集体の面積の５％以上が空隙３である。【選択図】図１ |
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【課題】粒度分布が整っており、良好な転写特性を有する微小な金属粒子凝集体、導電性フィルム、接続構造体、およびこれらの製造方法を提供する。【解決手段】金属粒子凝集体１は、金属粒子２の凝集体であって、表面に空隙３を有し、導電性フィルム５に転写し、導電性フィルム５の表面で観察したときに、平面視において凝集体の面積の５％以上が空隙３である。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CASTING ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; PERFORMING OPERATIONS ; POWDER METALLURGY ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; TRANSPORTING ; WORKING METALLIC POWDER</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231024&DB=EPODOC&CC=JP&NR=2023156104A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231024&DB=EPODOC&CC=JP&NR=2023156104A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUKAO SATOSHI</creatorcontrib><creatorcontrib>WATANABE KAZUMU</creatorcontrib><creatorcontrib>NODA DAIKI</creatorcontrib><creatorcontrib>HAYASHI NAOKI</creatorcontrib><creatorcontrib>NAMIKI HIDEJI</creatorcontrib><creatorcontrib>SHIRAIWA TOSHIKI</creatorcontrib><title>METAL PARTICLE AGGREGATE, CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THEM</title><description>To provide a fine metal particle aggregate having a uniform particle size distribution and having satisfactory transfer properties, a conductive film, a connection structure, and methods for producing them.SOLUTION: Each metal particle aggregate 1 is an aggregate of metal particles 2, has voids 3 in a surface, and when it is transferred to a conductive film 5 and is observed at a surface of the conductive film 5, 5% or more of the area of the aggregate is the voids 3 in plane view.SELECTED DRAWING: Figure 1
【課題】粒度分布が整っており、良好な転写特性を有する微小な金属粒子凝集体、導電性フィルム、接続構造体、およびこれらの製造方法を提供する。【解決手段】金属粒子凝集体１は、金属粒子２の凝集体であって、表面に空隙３を有し、導電性フィルム５に転写し、導電性フィルム５の表面で観察したときに、平面視において凝集体の面積の５％以上が空隙３である。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASTING</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>TRANSPORTING</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIj1dQ1x9FEIcAwK8XT2cVVwdHcPcnV3DHHVUXD293MJdQ7xDHNVcPP08QUL-LkCBfz9FIJDgoBSoUFADX4uCkAzPPxdFNz8gxQCgvyBmjz93BVCPFx9eRhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGRsaGpmaGBiaMxUYoAODky3w</recordid><startdate>20231024</startdate><enddate>20231024</enddate><creator>TSUKAO SATOSHI</creator><creator>WATANABE KAZUMU</creator><creator>NODA DAIKI</creator><creator>HAYASHI NAOKI</creator><creator>NAMIKI HIDEJI</creator><creator>SHIRAIWA TOSHIKI</creator><scope>EVB</scope></search><sort><creationdate>20231024</creationdate><title>METAL PARTICLE AGGREGATE, CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THEM</title><author>TSUKAO SATOSHI ; WATANABE KAZUMU ; NODA DAIKI ; HAYASHI NAOKI ; NAMIKI HIDEJI ; SHIRAIWA TOSHIKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023156104A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASTING</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>TRANSPORTING</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUKAO SATOSHI</creatorcontrib><creatorcontrib>WATANABE KAZUMU</creatorcontrib><creatorcontrib>NODA DAIKI</creatorcontrib><creatorcontrib>HAYASHI NAOKI</creatorcontrib><creatorcontrib>NAMIKI HIDEJI</creatorcontrib><creatorcontrib>SHIRAIWA TOSHIKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUKAO SATOSHI</au><au>WATANABE KAZUMU</au><au>NODA DAIKI</au><au>HAYASHI NAOKI</au><au>NAMIKI HIDEJI</au><au>SHIRAIWA TOSHIKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METAL PARTICLE AGGREGATE, CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THEM</title><date>2023-10-24</date><risdate>2023</risdate><abstract>To provide a fine metal particle aggregate having a uniform particle size distribution and having satisfactory transfer properties, a conductive film, a connection structure, and methods for producing them.SOLUTION: Each metal particle aggregate 1 is an aggregate of metal particles 2, has voids 3 in a surface, and when it is transferred to a conductive film 5 and is observed at a surface of the conductive film 5, 5% or more of the area of the aggregate is the voids 3 in plane view.SELECTED DRAWING: Figure 1
【課題】粒度分布が整っており、良好な転写特性を有する微小な金属粒子凝集体、導電性フィルム、接続構造体、およびこれらの製造方法を提供する。【解決手段】金属粒子凝集体１は、金属粒子２の凝集体であって、表面に空隙３を有し、導電性フィルム５に転写し、導電性フィルム５の表面で観察したときに、平面視において凝集体の面積の５％以上が空隙３である。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; jpn |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CASTING CONDUCTORS ELECTRICITY INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER PERFORMING OPERATIONS POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING WORKING METALLIC POWDER |
| title | METAL PARTICLE AGGREGATE, CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THEM |
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