WIRING BOARD

To enhance the quality and characteristics of a wiring board.SOLUTION: A wiring board 100 includes a first conductive layer 11 formed on a surface 21a of a first insulating layer 21, and a second insulating layer 22 laminated on the first conductive layer 11. The first conductive layer 11 includes a conductor pad 1a including a component mounting area A, and a wiring pattern 1c. The second insulating layer 22 has a through-hole 221 that exposes the component mounting area A. The surface 21a of the first insulating layer 21 includes a first region 211 and a second region 212 having a higher surface roughness than the first region. The wiring pattern 1c is formed in the first region 211, and the conductor pad 1a is formed in the second region 212.SELECTED DRAWING: Figure 2 【課題】配線基板の品質及び特性の向上。【解決手段】実施形態の配線基板１００は、第１絶縁層２１の表面２１ａ上に形成されている第１導体層１１と、第１導体層１１の上に積層されている第２絶縁層２２と、を含む。第１導体層１１は、部品搭載領域Ａを含む導体パッド１ａ、及び配線パターン１ｃを含む。第２絶縁層２２は部品搭載領域Ａを露出させる貫通孔２２１を有する。第１絶縁層２１の表面２１ａは、第１領域２１１及び第１領域よりも高い面粗度を有する第２領域２１２を含む。配線パターン１ｃは第１領域２１１に形成されており、導体パッド１ａは第２領域２１２に形成されている。【選択図】図２