SINTERABLE FILMS AND PASTES, AND METHODS FOR USE THEREOF

To provide sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages, a compound useful for the preparation of such films and pastes, and methods for producing such a compound.SOLUTION: A composition for a sintering film compr...

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Hauptverfasser:	LOUIS P RECTOR, SHASHI K GUPTA, ZHU PUKUN, ZHUO QIZHUO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages, a compound useful for the preparation of such films and pastes, and methods for producing such a compound.SOLUTION: A composition for a sintering film comprises: a thermosetting resin or a thermoplastic resin component, selected from the group consisting of one or more epoxy monomers, oligomers or polymers, acrylic monomers, oligomers or polymers, phenols, novalaks, and mixtures thereof; one or more conductive fillers; and optionally an organic diluent, wherein the composition undergoes lamination onto a wafer at a temperature of 100°C or lower and a pressure of 40 psi or lower; and wherein the composition, when cured or sintered, has a die shear strength of at least 1.0 kg/mm2 at 260°C.SELECTED DRAWING: None 【課題】ダイ半導体パッケージに使用するのに有利な特性を有する導電性のダイアタッチ材料としての焼結可能なフィルムおよびペースト、このようなフィルムおよびペーストの調製に有用な配合物、ならびにそのような配合物の製造方法を提供する。【解決手段】１種以上のエポキシモノマー、オリゴマーまたはポリマー、アクリルモノマー、オリゴマーまたはポリマー、フェノール系、ノボラックまたはそれらの混合物等からなる群から選択される、熱硬化性樹脂または熱可塑性樹脂成分、１種以上の導電性充填剤、および任意に有機希釈剤を含む焼結フィルムのための組成物であって、組成物が、１００℃以下の温度および４０ｐｓｉ以下の圧力でウエハー上にラミネートされ、硬化または焼結時に２６０℃で少なくとも１．０ｋｇ／ｍｍ２のダイせん断強度を有する、組成物とする。【選択図】なし