SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION, AND MOLDED BODY FORMED BY MOLDING THE SAME

To provide a semi-aromatic polyamide resin composition which is excellent in all of heat resistance, mechanical characteristics, thermal aging resistance, and chemical resistance.SOLUTION: There are provided: a semi-aromatic polyamide resin composition which contains 100 pts.mass of a semi-aromatic...

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Hauptverfasser:	YAMAGUCHI NAOHIRO, ASAI YOSHIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a semi-aromatic polyamide resin composition which is excellent in all of heat resistance, mechanical characteristics, thermal aging resistance, and chemical resistance.SOLUTION: There are provided: a semi-aromatic polyamide resin composition which contains 100 pts.mass of a semi-aromatic polyamide (A), containing an aromatic dicarboxylic acid component and an aliphatic diamine component and having a melting point of 280-350°C, 0.01-2 pts.mass of a copper compound (B), 0.05-10 pts.mass of a polyhydric alcohol (C) and 1-5 pts.mass of a phosphorus-based antioxidant (D), wherein the semi-aromatic polyamide resin composition further may contain 5-200 pts.mass of a fibrous reinforcement material (E); and a molded body formed by molding the semi-aromatic polyamide resin composition.SELECTED DRAWING: None 【課題】耐熱性、機械的特性、耐熱老化性、耐薬品性いずれにも優れた半芳香族ポリアミド樹脂組成物を提供する。【解決手段】芳香族ジカルボン酸成分と脂肪族ジアミン成分とを含有し、融点が２８０～３５０℃である半芳香族ポリアミド（Ａ）１００質量部、銅化合物（Ｂ）０．０１～２質量部、多価アルコール（Ｃ）０．０５～１０質量部、およびリン系酸化防止剤（Ｄ）１～５質量部を含有する半芳香族ポリアミド樹脂組成物、および、さらに繊維状強化材（Ｅ）５～２００質量部を含有する前記半芳香族ポリアミド樹脂組成物、および、前記半芳香族ポリアミド樹脂組成物を成形してなる成形体。【選択図】なし