REDUCED ELECTROLESS SILVER PLATING SOLUTION

To provide a reduced electroless silver plating solution free from cyan compounds, which can form a silver plating coating with sufficient stability as well as a good appearance and high conductivity.SOLUTION: A reduced electroless silver plating solution includes a silver salt, a reductant, an iodi...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAZAKI TAKASHI, KAWAMATA YUKINAO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a reduced electroless silver plating solution free from cyan compounds, which can form a silver plating coating with sufficient stability as well as a good appearance and high conductivity.SOLUTION: A reduced electroless silver plating solution includes a silver salt, a reductant, an iodide salt, and a compound represented by the general formula (1) or a salt thereof.SELECTED DRAWING: None 【課題】シアン化合物を含まない還元型無電解銀めっき液において、十分な安定性を有すると同時に、優れた外観と高い導電性を有する銀めっき皮膜を形成することができる還元型無電解銀めっき液を提供すること。【解決手段】銀塩、還元剤、ヨウ化物塩、および下記一般式（１）で表される化合物またはその塩を含有する還元型無電解銀めっき液。【化１】JPEG2023149890000006.jpg2077【選択図】なし