MULTILAYER POLYIMIDE FILM

To provide a polyimide film capable of suppressing cracks, breaks or splits that occur in a film, in an alkali environment during a roll-to-roll manufacturing process for a flexible metal laminate, a polyimide laminate film, as well as a metal-clad laminate.SOLUTION: The problem can be solved by a m...

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1. Verfasser:	UNO MARI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a polyimide film capable of suppressing cracks, breaks or splits that occur in a film, in an alkali environment during a roll-to-roll manufacturing process for a flexible metal laminate, a polyimide laminate film, as well as a metal-clad laminate.SOLUTION: The problem can be solved by a multilayer polyimide film that has a non-thermoplastic polyimide layer and at least one or more adhesive layer, wherein the adhesive layer contains polyimide and has a water vapor permeability of 40 g/m2 24 h or less when the adhesive layer is 25 μm thick, and has an elastic modulus of 4 GPa or more.SELECTED DRAWING: None 【課題】ロールツーロール式のフレキシブル金属積層板製造工程中のアルカリ環境下において、フィルムに発生するクラックや割れ・裂けを抑制できるポリイミドフィルム、ポリイミド積層フィルム、並びに金属張積層体を提供することにある。【解決手段】非熱可塑性ポリイミド層と少なくとも1層以上接着層とを有する多層ポリイミドフィルムであって、前記接着層にポリイミドを含有し、接着層の２５μｍ厚み時の水蒸気透過率が４０ｇ／ｍ２・２４ｈ以下であり、かつ、接着層の弾性率が４ＧＰａ以上であることを特徴とする多層ポリイミドフィルムにより上記課題を解決することができる。【選択図】なし