IMAGING DEVICE AND ELECTRONIC APPARATUS
To suppress generation of stray light components and improve image quality.SOLUTION: Included are: a chip on which a photoelectric conversion element is formed; a cover glass; a first joining part configured to join the chip and the cover glass; and a second joining part joined to the first joining...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To suppress generation of stray light components and improve image quality.SOLUTION: Included are: a chip on which a photoelectric conversion element is formed; a cover glass; a first joining part configured to join the chip and the cover glass; and a second joining part joined to the first joining part and the chip. A joining surface where the first and second joining parts are joined is positioned parallel to the cover glass. The present technology can be applied, for example, to a packaged imaging device.SELECTED DRAWING: Figure 1
【課題】迷光成分の発生を抑制し、画質を向上させる。【解決手段】光電変換素子が形成されたチップと、カバーガラスと、前記チップと前記カバーガラスとを接合する第１の接合部と、前記第１の接合部と前記チップとに接合されている第２の接合部とを備え、前記第１の接合部と前記第２の接合部が接合している接合面は、前記カバーガラスと平行となる位置にある。本技術は、例えば、パッケージ化された撮像装置に適用できる。【選択図】図１ |
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