POLYINDENE COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR ENCAPSULANT, AND SEMICONDUCTOR DEVICE

To provide a polyindane compound that exhibits a low dielectric loss tangent when cured, a curable composition containing the polyindane compound, and a cured product thereof.SOLUTION: A polyindene compound is disclosed whose reaction ingredients are an indene compound and a linear olefin compound w...

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Bibliographische Detailangaben
Hauptverfasser:	HAYASHI HIROSHI, KIM YOUNGAN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ACYCLIC OR CARBOCYCLIC COMPOUNDS AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a polyindane compound that exhibits a low dielectric loss tangent when cured, a curable composition containing the polyindane compound, and a cured product thereof.SOLUTION: A polyindene compound is disclosed whose reaction ingredients are an indene compound and a linear olefin compound with 3 or more carbon atoms having a leaving group at an end, which may be substituted with an alkyl or aryl group.SELECTED DRAWING: None 【課題】本開示は、硬化時において、低誘電正接を示すポリインダン化合物、当該ポリインダン化合物を含有する硬化性組成物及びその硬化物を提供することを目的とする。【解決手段】本開示は、インデン化合物と、アルキル基又はアリール基に置換されてもよい、末端に脱離基を有する炭素原子数３以上の鎖状のオレフィン化合物とを反応原料とする、ポリインデン化合物である。【選択図】なし