SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY
To provide a surface treatment agent that exhibits excellent heat resistance of a chemical conversion film formed on a copper surface and ensures good solderability during soldering.SOLUTION: A surface treatment agent for copper or a copper alloy according to the present invention contains: an imida...
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| creator | YOSHINARI KOICHI NAKANISHI MASATO MAE TOMOYA |
| description | To provide a surface treatment agent that exhibits excellent heat resistance of a chemical conversion film formed on a copper surface and ensures good solderability during soldering.SOLUTION: A surface treatment agent for copper or a copper alloy according to the present invention contains: an imidazole compound represented by chemical formula (I) or a benzimidazole compound represented by chemical formula (II); and a triazole compound represented by chemical formula (III). The definition of each substituent in chemical formulae (I)-(III) is the same as that defined in the specification.SELECTED DRAWING: None
【課題】銅表面に形成される化成皮膜の耐熱性に優れ、半田付けを行う際には、良好な半田付け性が得られる表面処理剤を提供すること。【解決手段】化学式（Ｉ）で示されるイミダゾール化合物または化学式（ＩＩ）で示されるベンズイミダゾール化合物と、化学式（ＩＩＩ）で示されるトリアゾール化合物を含有する銅または銅合金の表面処理剤とする。化学式（Ｉ）～（ＩＩＩ）中の各置換基の定義は、明細書中の定義と同じである。【化１】TIFF2023146899000028.tif35165【選択図】なし |
| format | Patent |
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【課題】銅表面に形成される化成皮膜の耐熱性に優れ、半田付けを行う際には、良好な半田付け性が得られる表面処理剤を提供すること。【解決手段】化学式（Ｉ）で示されるイミダゾール化合物または化学式（ＩＩ）で示されるベンズイミダゾール化合物と、化学式（ＩＩＩ）で示されるトリアゾール化合物を含有する銅または銅合金の表面処理剤とする。化学式（Ｉ）～（ＩＩＩ）中の各置換基の定義は、明細書中の定義と同じである。【化１】TIFF2023146899000028.tif35165【選択図】なし</description><language>eng ; jpn</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231012&DB=EPODOC&CC=JP&NR=2023146899A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231012&DB=EPODOC&CC=JP&NR=2023146899A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHINARI KOICHI</creatorcontrib><creatorcontrib>NAKANISHI MASATO</creatorcontrib><creatorcontrib>MAE TOMOYA</creatorcontrib><title>SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY</title><description>To provide a surface treatment agent that exhibits excellent heat resistance of a chemical conversion film formed on a copper surface and ensures good solderability during soldering.SOLUTION: A surface treatment agent for copper or a copper alloy according to the present invention contains: an imidazole compound represented by chemical formula (I) or a benzimidazole compound represented by chemical formula (II); and a triazole compound represented by chemical formula (III). The definition of each substituent in chemical formulae (I)-(III) is the same as that defined in the specification.SELECTED DRAWING: None
【課題】銅表面に形成される化成皮膜の耐熱性に優れ、半田付けを行う際には、良好な半田付け性が得られる表面処理剤を提供すること。【解決手段】化学式（Ｉ）で示されるイミダゾール化合物または化学式（ＩＩ）で示されるベンズイミダゾール化合物と、化学式（ＩＩＩ）で示されるトリアゾール化合物を含有する銅または銅合金の表面処理剤とする。化学式（Ｉ）～（ＩＩＩ）中の各置換基の定義は、明細書中の定義と同じである。【化１】TIFF2023146899000028.tif35165【選択図】なし</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKDg1yc3R2VQgJcnUM8XX1C1FwdAeRbv5BCs7-AQGuQQoIlqOPj38kDwNrWmJOcSovlOZmUHJzDXH20E0tyI9PLS5ITE7NSy2J9wowMjAyNjQxs7C0dDQmShEAwYUnTA</recordid><startdate>20231012</startdate><enddate>20231012</enddate><creator>YOSHINARI KOICHI</creator><creator>NAKANISHI MASATO</creator><creator>MAE TOMOYA</creator><scope>EVB</scope></search><sort><creationdate>20231012</creationdate><title>SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY</title><author>YOSHINARI KOICHI ; NAKANISHI MASATO ; MAE TOMOYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023146899A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHINARI KOICHI</creatorcontrib><creatorcontrib>NAKANISHI MASATO</creatorcontrib><creatorcontrib>MAE TOMOYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHINARI KOICHI</au><au>NAKANISHI MASATO</au><au>MAE TOMOYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY</title><date>2023-10-12</date><risdate>2023</risdate><abstract>To provide a surface treatment agent that exhibits excellent heat resistance of a chemical conversion film formed on a copper surface and ensures good solderability during soldering.SOLUTION: A surface treatment agent for copper or a copper alloy according to the present invention contains: an imidazole compound represented by chemical formula (I) or a benzimidazole compound represented by chemical formula (II); and a triazole compound represented by chemical formula (III). The definition of each substituent in chemical formulae (I)-(III) is the same as that defined in the specification.SELECTED DRAWING: None
【課題】銅表面に形成される化成皮膜の耐熱性に優れ、半田付けを行う際には、良好な半田付け性が得られる表面処理剤を提供すること。【解決手段】化学式（Ｉ）で示されるイミダゾール化合物または化学式（ＩＩ）で示されるベンズイミダゾール化合物と、化学式（ＩＩＩ）で示されるトリアゾール化合物を含有する銅または銅合金の表面処理剤とする。化学式（Ｉ）～（ＩＩＩ）中の各置換基の定義は、明細書中の定義と同じである。【化１】TIFF2023146899000028.tif35165【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY |
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