SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY

To provide a surface treatment agent that exhibits excellent heat resistance of a chemical conversion film formed on a copper surface and ensures good solderability during soldering.SOLUTION: A surface treatment agent for copper or a copper alloy according to the present invention contains: an imida...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOSHINARI KOICHI, NAKANISHI MASATO, MAE TOMOYA
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a surface treatment agent that exhibits excellent heat resistance of a chemical conversion film formed on a copper surface and ensures good solderability during soldering.SOLUTION: A surface treatment agent for copper or a copper alloy according to the present invention contains: an imidazole compound represented by chemical formula (I) or a benzimidazole compound represented by chemical formula (II); and a triazole compound represented by chemical formula (III). The definition of each substituent in chemical formulae (I)-(III) is the same as that defined in the specification.SELECTED DRAWING: None 【課題】銅表面に形成される化成皮膜の耐熱性に優れ、半田付けを行う際には、良好な半田付け性が得られる表面処理剤を提供すること。【解決手段】化学式(I)で示されるイミダゾール化合物または化学式(II)で示されるベンズイミダゾール化合物と、化学式(III)で示されるトリアゾール化合物を含有する銅または銅合金の表面処理剤とする。化学式(I)~(III)中の各置換基の定義は、明細書中の定義と同じである。【化1】TIFF2023146899000028.tif35165【選択図】なし