CIRCUIT BOARD CONDUCTIVE FILM, CIRCUIT BOARD FILM, METHOD FOR MANUFACTURING CIRCUIT BOARD CONDUCTIVE FILM, AND METHOD FOR MANUFACTURING CIRCUIT BOARD FILM

To provide a circuit board conductive film excellent in adhesion between a base material and a laminate (a seed layer) and capable of being suitably used for a circuit board; a circuit board film; a method for manufacturing the circuit board conductive film; and a method for manufacturing the circuit board film.SOLUTION: A circuit board conductive film includes a base material, and a laminate provided on the side of at least one surface of the base material. The laminate includes a seed layer and a thin film copper layer in this order from the base material side. The seed layer includes copper, nickel, nitrogen, and oxygen; and in the seed layer, the content of oxygen (O) calculated from the intensity of a characteristic X ray discharged with outer shell electron transition to the K shell being the innermost shell from an outer shell by EDX elemental analysis at an accelerating voltage of 10 kV is 2.3-7.7 mass%, and the content of nitrogen (N) is 1.4-6.8 mass%.SELECTED DRAWING: Figure 1 【課題】基材と積層体（シード層）との密着性が優れ、回路基板用として好適に採用し得る回路基板用導電性フィルム、回路基板用フィルム、回路基板用導電性フィルムの製造方法、回路基板用フィルムの製造方法を提供する。【解決手段】基材と、基材の少なくとも一方の面側に設けられた積層体とを備え、積層体は、基材側から、シード層と、薄膜銅層とをこの順に有し、シード層は、銅と、ニッケルと、窒素と、酸素とを含み、シード層において、加速電圧１０ｋＶにおけるＥＤＸ元素分析により、外殻から最内殻であるＫ殻への外殻電子遷移に伴い放出される特性Ｘ線強度から算出される、酸素（Ｏ）の含有量は２．３～７．７質量％であり、窒素（Ｎ）の含有量は１．４～６．８質量％である、回路基板用導電性フィルム。【選択図】図１