THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THERMOSETTING RESIN COMPOSITION, AND SOLDER RESIST FORMED OF THERMOSETTING RESIN COMPOSITION

To provide a thermosetting resin composition capable of reducing a dielectric loss tangent while having a high dielectric constant.SOLUTION: The thermosetting resin composition contains (A) an epoxy compound, (B) a compound having a maleimide group, (C) an inorganic filler, and (D) a thermosetting c...

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Bibliographische Detailangaben
Hauptverfasser:	ARIMA KATSUYA, HORI ATSUSHI, EIZAI HIROSHI, OKUMURA RYOYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a thermosetting resin composition capable of reducing a dielectric loss tangent while having a high dielectric constant.SOLUTION: The thermosetting resin composition contains (A) an epoxy compound, (B) a compound having a maleimide group, (C) an inorganic filler, and (D) a thermosetting catalyst. The inorganic filler (C) contains (C1) metal oxide particles. The metal oxide particles (C1) are contained in an amount of 50 mass% or more and 90 mass% or less in the solid content of the thermosetting resin composition.SELECTED DRAWING: None 【課題】高い誘電率を有しつつ、誘電正接を低減できる熱硬化性樹脂組成物を提供する。【解決手段】（Ａ）エポキシ化合物と、（Ｂ）マレイミド基を有する化合物と、（Ｃ）無機フィラーと、（Ｄ）熱硬化触媒と、を含有する熱硬化性樹脂組成物であり、前記（Ｃ）無機フィラーが、（Ｃ１）金属酸化物粒子を含有し、前記（Ｃ１）金属酸化物粒子が、前記熱硬化性樹脂組成物の固形分中に５０質量％以上９０質量％以下含まれる熱硬化性樹脂組成物。【選択図】なし