SEMICONDUCTOR LIGHT EMITTING DEVICE, BASE, SOLDERED BASE, AND MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT EMITTING DEVICE

To provide a semiconductor light emitting device and the like that can suppress liquid solder from protruding from the longitudinal side surfaces of a semiconductor laser bar.SOLUTION: A semiconductor light emitting device includes a base 2 having a wiring member 10, a semiconductor laser bar 3, and a solder 4 placed between the wiring member 10 and the semiconductor laser bar 3. The surface of the wiring member 10 on the semiconductor laser bar 3 side includes a connection region 10a that is an interface with the solder 4, and a block region 10b whose contact angle with respect to the solder 4 is larger than 90 degrees. The connection region 10a is located inside a side surface S3 of the semiconductor laser bar 3 in the longitudinal direction in a top view. At least a part of the block region 10b is located between the connection region 10a and the side surface S3 in the top view. The inner part of the block region 10b in the longitudinal direction is located inside the side surface S3. The solder 4 includes a rear side extending portion 4a extending outward from a rear end surface S2 in the top view, and does not extend outward from the pair of side surfaces S3.SELECTED DRAWING: Figure 1 【課題】液状の半田が半導体レーザバーの長手方向の側面からはみ出すことを抑制できる半導体発光装置等を提供する。【解決手段】配線部材１０を有する基台２と、半導体レーザバー３と、配線部材１０と半導体レーザバー３との間に配置された半田４と、を備え、配線部材１０の半導体レーザバー３側の面には、半田４との界面である接続領域１０ａと、半田４に対する接触角が９０度より大きいブロック領域１０ｂとが含まれ、接続領域１０ａは、上面視において、長手方向における半導体レーザバー３の側面Ｓ３の内側に位置し、ブロック領域１０ｂの少なくとも一部は、上面視において、接続領域１０ａと側面Ｓ３との間に位置し、長手方向におけるブロック領域１０ｂの内側部分は、側面Ｓ３よりも内側に位置し、半田４は、上面視においてリア端面Ｓ２から外側に延伸するリア側延伸部４ａを有し、かつ、一対の側面Ｓ３から外側には延伸していない。【選択図】図１