SEMICONDUCTOR DEVICE

To provide a semiconductor device with improved reliability.SOLUTION: A semiconductor device according to an embodiment is a semiconductor device including: an element region; and an outer peripheral region surrounding the element region. The outer peripheral region includes: a semiconductor layer having a first face and a second face opposite to the first face; a first annular conductor provided on a side of the first face with respect to the semiconductor layer and surrounding the element region; a second annular conductor provided on the side of the first face with respect to the semiconductor layer and surrounding the first annular conductor; and at least one first connection conductor provided between the first annular conductor and the second annular conductor and connected to the first annular conductor and the second annular conductor.SELECTED DRAWING: Figure 1 【課題】信頼性が向上する半導体装置を提供する。【解決手段】実施形態の半導体装置は、素子領域と、素子領域を囲む外周領域と、を備えた半導体装置であって、外周領域は、第１の面と、第１の面に対向する第２の面と、を有する半導体層と、半導体層に対し第１の面の側に設けられ、素子領域を囲む第１の環状導電体と、半導体層に対し第１の面の側に設けられ、第１の環状導電体を囲む第２の環状導電体と、第１の環状導電体と第２の環状導電体との間に設けられ、第１の環状導電体及び第２の環状導電体に接続される少なくとも一つの第１の接続導電体と、を含む。【選択図】図１