ELECTRONIC COMPONENT
To provide an electronic component which has high vibration resistance and excellent mounting property.SOLUTION: An electronic component has a molding 11, a conductor 12 embedded in the molding 11, and a metal plate 13 mounted so as to surround a bottom surface 11a and both end faces 11c and 11d of...
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Zusammenfassung: | To provide an electronic component which has high vibration resistance and excellent mounting property.SOLUTION: An electronic component has a molding 11, a conductor 12 embedded in the molding 11, and a metal plate 13 mounted so as to surround a bottom surface 11a and both end faces 11c and 11d of the molding, wherein the metal plate 13 overlapping the one end face 11c and a terminal 12a of the conductor are electrically and mechanically joined to each other, a through hole 13a is provided in a part overlapping the other end face 11d of the metal plate and a projection 11e is provided on the one end face 11c, the projection 11e is engaged with the through hole 13a, and in a gap 15 between the through hole 13a and the projection 11e, at least the gap 15 on the side of a top surface 11b of the molding is filled with a resin filler 14.SELECTED DRAWING: Figure 1
【課題】耐振性が高く、かつ実装性にもすぐれた電子部品を提供することを目的とする。【解決手段】成形体11と、成形体11に埋設された導体12と、成形体の底面11aと両端面11c、11dを取り囲むように取り付けられた金属板13と、を有する電子部品であって、一方の端面11cに重なる金属板13と導体の端部12aとは電気的機械的に接合され、金属板の他方の端面11dに重なる部分には貫通孔13aが設けられ一方の端面11cには凸部11eが設けられて、貫通孔13aに凸部11eを係止したものであり、貫通孔13aと凸部11eとの間の隙間15のうち、少なくとも成形体の天面11b側の隙間15には樹脂製の充填材14が充填されている電子部品。【選択図】図1 |
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