WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

To solve a problem in which an external connection terminal is peeled off or comes off in a wiring board that has a main surface on which a wiring layer is formed and a back surface on which the external connection terminal is provided, and to improve the heat dissipation and heat resistance of the external connection terminals.SOLUTION: In a semiconductor device 1, a wiring board 3 includes an external connection terminal 40 provided on the bottom, an insulating layer 31 surrounding the external connection terminal 40, and a wiring layer 43 which is an upper layer of the insulating layer 31 and is electrically connected to the external connection terminal 40 via a via provided in the insulating layer 31. A plurality of convex portions 141 projecting upward is provided on the upper surface of a bottom conductive layer 41 that constitutes the bottom surface of the external connection terminal 40.SELECTED DRAWING: Figure 1 【課題】配線層が形成される主面と外部接続端子が設けられた裏面を有する配線基板において、外部接続端子が剥離又は抜脱するという課題を解決し、外部接続端子の放熱性及び耐熱性を向上させる。【解決手段】半導体装置１において、配線基板３は、底面に設けられた外部接続端子４０と、外部接続端子４０を取り囲む絶縁層３１と、絶縁層３１の上層であり、絶縁層３１に設けられたビアを介して外部接続端子４０と電気的に接続される配線層４３と、を備える。外部接続端子４０の底面を構成する底部導電層４１の上面には、上方に突出する複数の凸部１４１を設ける。【選択図】図１