MOUNTING EQUIPMENT, INSPECTION EQUIPMENT, ELEMENT ASSEMBLY METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
To provide a technique for improving the accuracy of inspection of bonded materials.SOLUTION: A mounting equipment comprises an imaging device directed at a bonding material having a mirror-reflective surface, an illumination device having a light source installed above the bonding material, and a c...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a technique for improving the accuracy of inspection of bonded materials.SOLUTION: A mounting equipment comprises an imaging device directed at a bonding material having a mirror-reflective surface, an illumination device having a light source installed above the bonding material, and a control unit configured to inspect the bonding material based on multiple images obtained by the imaging device photographing the bonding material by changing the irradiation position of the light source.SELECTED DRAWING: Figure 4
【課題】接合材料の検査の精度を向上させるための技術を提供することにある。【解決手段】実装装置は、鏡面反射面を有する接合材料に向けられる撮像装置と、前記接合材料の上方に設けられる光源を有する照明装置と、前記光源の照射位置を変えて前記撮像装置が前記接合材料を撮影して得た複数の画像に基づいて前記接合材料を検査するよう構成される制御装置と、を備える。【選択図】図４ |
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