COIL DEVICE

To provide a coil device which has high heat dissipation property as a whole device, and can reduce its height.SOLUTION: A coil device 1 has: a second bobbin 20 provided with a second coil 92; cores 30b and 30c mounted on the second bobbin 20; a case 40 for storing the second bobbin 20, and the core...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: DENDA SATOSHI, FURUICHI TOMOHIRO, KUMAGAI MASARU
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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