RESIN COMPOSITION

To provide a resin composition that can yield a cured product having excellent crack resistance after desmear treatment.SOLUTION: A resin composition contains (A) a styrenic and/or hydrogenated styrenic polymer with a weight average molecular weight of 10000 or less, (B) an epoxy resin, and (C) an a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OISHI RYOHEI, KAWAI KENJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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