RESIN COMPOSITION

To provide a resin composition that can yield a cured product having excellent crack resistance after desmear treatment.SOLUTION: A resin composition contains (A) a styrenic and/or hydrogenated styrenic polymer with a weight average molecular weight of 10000 or less, (B) an epoxy resin, and (C) an a...

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Bibliographische Detailangaben
Hauptverfasser:	OISHI RYOHEI, KAWAI KENJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a resin composition that can yield a cured product having excellent crack resistance after desmear treatment.SOLUTION: A resin composition contains (A) a styrenic and/or hydrogenated styrenic polymer with a weight average molecular weight of 10000 or less, (B) an epoxy resin, and (C) an active ester compound.SELECTED DRAWING: None 【課題】デスミア処理後のクラック耐性に優れた硬化物を得ることができる樹脂組成物を提供する。【解決手段】（Ａ）重量平均分子量が１００００以下のスチレン系及び／又は水添スチレン系重合体、（Ｂ）エポキシ樹脂、並びに（Ｃ）活性エステル化合物を含む樹脂組成物。【選択図】なし