METHOD FOR MANUFACTURING COMMUNICATION DEVICE

To provide a method for manufacturing a communication device that improves yield.SOLUTION: A method for manufacturing a communication device 10 includes forming an antenna board assembly 20 and forming a circuit board assembly 30 separately from the antenna board assembly 20. The method for manufact...

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Hauptverfasser:	WAKIYAMA SATORU, HIRATA SHUJI, NIIOBI AKIRA, SHIROSAKI TOSHIFUMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide a method for manufacturing a communication device that improves yield.SOLUTION: A method for manufacturing a communication device 10 includes forming an antenna board assembly 20 and forming a circuit board assembly 30 separately from the antenna board assembly 20. The method for manufacturing the communication device 10 includes connecting the antenna board assembly 20 and the circuit board assembly 30 in a state in which a power feeding pad 202 and a power feeding line 120 are connected. Therefore, the step of forming the circuit board assembly 30 and the step of forming the antenna board assembly 20 are performed separately.SELECTED DRAWING: Figure 1 【課題】歩留まり向上するようにした通信装置の製造方法を提供する。【解決手段】通信装置１０の製造方法は、アンテナ基板アッセンブリ２０を形成することと、回路基板アッセンブリ３０をアンテナ基板アッセンブリ２０と別々に形成することを含む。通信装置１０の製造方法は、給電用パッド２０２と給電線路１２０とを接続した状態で、アンテナ基板アッセンブリ２０と回路基板アッセンブリ３０とを接続させることとを含む。したがって、回路基板アッセンブリ３０を形成する工程とアンテナ基板アッセンブリ２０を形成する工程とを別々に実施する。【選択図】図１