SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

To provide a semiconductor device capable of suppressing occurrence of a crack in an insulation film, and a method for manufacturing the same.SOLUTION: According to an embodiment, a semiconductor device comprises a substrate, a first film including a plurality of electrode layers alternately provide...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KASHIWADA SAORI, FURUKAWA SHINICHI, ICHIKAWA HISASHI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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