SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE

To provide a solder composition excellent in both printability and a dripping property during heating.SOLUTION: The solder composition contains: a flux composition containing (A) a rosin-based resin, (B) an activator and (C) a thixotropic agent; and (D) a solder powder. The (C) component contains (C...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA SUMIRE, OKADA NAOKI, ICHIKAWA DAIGO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a solder composition excellent in both printability and a dripping property during heating.SOLUTION: The solder composition contains: a flux composition containing (A) a rosin-based resin, (B) an activator and (C) a thixotropic agent; and (D) a solder powder. The (C) component contains (C1) an amide compound having a weight average molecular weight Mw from 500 to 2500 inclusive, a number average molecular weight Mn from 500 to 1500 inclusive, and a value of Mw/Mn from 1.2 to 2.5 inclusive.SELECTED DRAWING: None 【課題】印刷性と加熱時のダレ性の両方が優れるはんだ組成物を提供すること。【解決手段】（Ａ）ロジン系樹脂、（Ｂ）活性剤、および（Ｃ）チクソ剤を含有するフラックス組成物と、（Ｄ）はんだ粉末とを含有し、前記（Ｃ）成分が、（Ｃ１）重量平均分子量Ｍｗが５００以上２５００以下であり、数平均分子量Ｍｎが５００以上１５００以下であり、Ｍｗ／Ｍｎの値が１．２以上２．５以下であるアミド化合物を含有する、はんだ組成物。【選択図】なし