RESIN COMPOSITION, HEAT RADIATION MEMBER AND ELECTRONIC APPARATUS

To provide a resin composition with excellent dispersibility of thermally conductive particles, suitable for producing a molded article with excellent heat dissipation, and to provide a heat radiation member and an electronic apparatus each including the resin composition.SOLUTION: A resin compositi...

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Hauptverfasser: SHIMOJITOSHO AKIRA, OGATA TAKEHIRO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a resin composition with excellent dispersibility of thermally conductive particles, suitable for producing a molded article with excellent heat dissipation, and to provide a heat radiation member and an electronic apparatus each including the resin composition.SOLUTION: A resin composition includes a resin component, a dispersant, and thermally conductive particles. The dispersant includes a constitutional unit (A), which is at least one selected from the group consisting of constitutional units (A-1), (A-1'), (A-2), (A-2') represented by the following formulae.SELECTED DRAWING: None 【課題】熱伝導性粒子の分散性に優れ、かつ放熱性に優れる成形体の作製に適した樹脂組成物を提供する。また、該樹脂組成物を用いた放熱部材及び電子機器を提供する。【解決手段】樹脂成分と、分散剤と、熱伝導性粒子とを含有する樹脂組成物であって、前記分散剤は、下記式で表される構成単位(A-1)、(A-1')、(A-2)、(A-2')等からなる群から選ばれる少なくとも1種である構成単位(A)を有する、樹脂組成物。TIFF2023127557000021.tif28156TIFF2023127557000022.tif28156【選択図】なし