ELECTROLESS PLATING INHIBITING COMPOSITION AND METHOD FOR PRODUCING PLATED COMPONENT

To provide an electroless plating inhibiting composition capable of improving the deposition and selectivity of electroless plating when forming a high-definition pattern.SOLUTION: An electroless plating inhibiting composition includes a catalytic activity inhibitor to inhibit the activity of an ele...

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Bibliographische Detailangaben
Hauptverfasser:	YUSA ATSUSHI, SUZUKI TATSUKI, TSUCHIHATA MIYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide an electroless plating inhibiting composition capable of improving the deposition and selectivity of electroless plating when forming a high-definition pattern.SOLUTION: An electroless plating inhibiting composition includes a catalytic activity inhibitor to inhibit the activity of an electroless plating catalyst, a water repellent, and a solvent comprising glycol ether. A catalytic activity inhibiting layer formed by the electroless plating inhibiting composition has a surface water contact angle of 50° or more.SELECTED DRAWING: None 【課題】高精細のパターンを形成したときの無電解メッキの析出性及び選択性を向上させることができる無電解メッキ抑制組成物を提供する。【解決手段】無電解メッキ抑制組成物は、無電解メッキ触媒の活性を妨害する触媒活性妨害剤と、撥水剤と、グリコールエーテルを含む溶剤と、を含み、前記無電解メッキ抑制組成物によって形成される触媒活性妨害層の表面の水接触角が５０°以上である。【選択図】なし