SEMICONDUCTOR DEVICE

To provide a semiconductor device which suppresses wire flow and can suppress increase in physical size.SOLUTION: A sealing body 30 is a resin molding, and seals a semiconductor element 40L, at least a part of a substrate 50, a part of a signal terminal 93L, a bonding wire 110, and a relay substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAMURA TOSHIHIRO, OKUMURA TOMOMI, KUSAMA HIROTOSHI, SHIMOTSUMA AYAKO, MIZUNO NAOHITO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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