COMPOSITION AND POLYIMIDE FILM

To provide a composition containing a polyimide precursor and/or a polyimide low in dielectric constant and dielectric loss tangent and high in heat resistance, and a polyimide film obtained by curing the composition.SOLUTION: The composition contains at least one of a polyimide precursor and a poly...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KOSUGE TAKAHIRO, SHIRATORI KAZUYA, NOZAWA KOTARO, TODA ATSUSHI, YAGI ERI, INATOMI YU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a composition containing a polyimide precursor and/or a polyimide low in dielectric constant and dielectric loss tangent and high in heat resistance, and a polyimide film obtained by curing the composition.SOLUTION: The composition contains at least one of a polyimide precursor and a polyimide having a tetracarboxylic acid residue and a diamine residue. The cohesive energy density of the polyimide precursor and the polyimide is 600 J/cc or less. The polyimide film is obtained by curing the composition.SELECTED DRAWING: None 【課題】比誘電率及び誘電正接が低く、かつ、耐熱性の高いポリイミド前駆体及び／又はポリイミドを含む組成物、並びに該組成物を硬化してなるポリイミドフィルムを提供すること。【解決手段】テトラカルボン酸残基及びジアミン残基を有する、ポリイミド前駆体並びにポリイミドの少なくともいずれか一方を含む組成物であって、前記ポリイミド前駆体及びポリイミドの凝集エネルギー密度が６００Ｊ／ｃｃ以下である組成物、及び該組成物を硬化してなるポリイミドフィルムである。【選択図】なし