LAMINATED ELECTRONIC COMPONENT

To improve the bending strength of a laminated electronic component.SOLUTION: A laminated electronic component includes a main body 110 including a plurality of internal electrodes 121, 122 and a dielectric layer 111 disposed between the plurality of internal electrodes, and external electrodes 200,...

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Hauptverfasser: CHOI HYUNG JONG, LEE YOO JEONG, LEE CHUNG YEOL, LEE JONG HO, AN SO JUNG, PARK MYUN-JUN, SUNG WOO KYUNG, WON KWANG YEUN
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To improve the bending strength of a laminated electronic component.SOLUTION: A laminated electronic component includes a main body 110 including a plurality of internal electrodes 121, 122 and a dielectric layer 111 disposed between the plurality of internal electrodes, and external electrodes 200, 300 including electrode layers 132a, 132b arranged on the main body and connected to the plurality of internal electrodes and conductive resin layers 133a, 133b arranged on the electrode layers. The electrode layer includes an island region.SELECTED DRAWING: Figure 2 【課題】積層型電子部品の曲げ強度を改善する。【解決手段】積層型電子部品は、複数の内部電極121,122及び複数の内部電極の間に配置された誘電体層111を含む本体110と、本体に配置されて複数の内部電極と接続される電極層132a、132b及び電極層上に配置される導電性樹脂層133a、133bを含む外部電極200、300と、を含む。電極層は、アイランド領域を含む。【選択図】図2