CURABLE COMPOSITION AND CURED PRODUCT THEREOF

To provide a curable composition that gives a cured product having low gloss, and a cured product thereof.SOLUTION: An inventive curable composition contains an epoxy compound, and a wax with a melting point of 170°C or lower.SELECTED DRAWING: None 【課題】光沢度の低い硬化物を得るための硬化性組成物およびその硬化物を提供する。【解決手段】本発明の硬化...

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Bibliographische Detailangaben
Hauptverfasser:	TSUSAWA KIE, NISHITANI YOSHINORI, MIZUNO KATSUTOSHI, MATSUO AKIRA, KOMATA AYUMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a curable composition that gives a cured product having low gloss, and a cured product thereof.SOLUTION: An inventive curable composition contains an epoxy compound, and a wax with a melting point of 170°C or lower.SELECTED DRAWING: None 【課題】光沢度の低い硬化物を得るための硬化性組成物およびその硬化物を提供する。【解決手段】本発明の硬化性組成物は、エポキシ化合物と、融点が１７０℃以下であるワックスとを含有する。【選択図】なし