SOLDER AND FLUX PRINTING METHOD, PRINTING DEVICE

To provide a solder and flux printing method capable of printing the optimum amount of solder in the proper position compatible with large and small mounted components.SOLUTION: A method of printing solder and flux on a substrate 100 includes the steps of: printing a first flux layer 101 consisting...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FUSAYASU KOJI, TSUJITA KAZUMA, KAWAMURA YOSHITOKU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a solder and flux printing method capable of printing the optimum amount of solder in the proper position compatible with large and small mounted components.SOLUTION: A method of printing solder and flux on a substrate 100 includes the steps of: printing a first flux layer 101 consisting of material that includes flux but does not include solder on the substrate 100 either directly or through other layers; printing a first solder layer 102 made of a material that includes solder on the first flux layer 101; and printing a second flux layer 103 made of a material that includes flux but does not include solder on the first solder layer 102.SELECTED DRAWING: Figure 1 【課題】大型の実装部品、小型の実装部品に対応し、最適な量の半田を適切な位置に適切な量だけ印刷する。【解決手段】基板１００上に半田とフラックスを印刷する方法であって、基板１００上に直接または他の層を介して、フラックスを含み半田を含まない材料からなる第１フラックス層１０１を印刷する工程と、第１フラックス層１０１上に、半田を含む材料からなる第１半田層１０２を印刷する工程と、第１半田層１０２上に、フラックスを含み半田を含まない材料からなる第２フラックス層１０３を印刷する工程と、を備える。【選択図】図１