SEMICONDUCTOR DEVICE AND VEHICLE

To inhibit cracks from occurring in a wire and disconnection of the wire in a semiconductor device in which a connection structure of a lead frame and the wire on the semiconductor device is sealed with a solid resin.SOLUTION: A semiconductor device (1) is formed including: a substrate (6); a semico...

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Bibliographische Detailangaben
1. Verfasser:	HAYAKAWA TSUTOMU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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