MODIFIED EPOXY RESIN, RESIN COMPOSITION, CURED PRODUCT, LAMINATE FOR ELECTRIC AND ELECTRONIC CIRCUITS, AND METHOD FOR PRODUCING MODIFIED EPOXY RESIN

To provide a modified epoxy resin having excellent solvent solubility, resin compatibility and adhesion, a resin composition comprising the modified epoxy resin and a curing agent, a cured product thereof having excellent dielectric properties, heat resistance and flame retardancy, and a laminate fo...

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Bibliographische Detailangaben
Hauptverfasser:	AKIBA KEITA, SATO HIROSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a modified epoxy resin having excellent solvent solubility, resin compatibility and adhesion, a resin composition comprising the modified epoxy resin and a curing agent, a cured product thereof having excellent dielectric properties, heat resistance and flame retardancy, and a laminate for electric and electronic circuits comprising the resin composition.SOLUTION: A composition comprises a modified epoxy resin which is a specific bisphenol-type epoxy resin with an epoxy equivalent of 280-50,000 g/eq. and a curing agent.SELECTED DRAWING: None 【課題】溶剤溶解性、樹脂相溶性及び接着性に優れた変性エポキシ樹脂、この変性エポキシ樹脂と硬化剤とを含む樹脂組成物、誘電特性、耐熱性及び難燃性に優れたその硬化物、並びに該樹脂組成物からなる電気・電子回路用積層板を提供する。【解決手段】特定のビスフェノール型エポキシ樹脂であり、エポキシ当量が２８０～５０，０００ｇ／ｅｑ．である変性エポキシ樹脂及び硬化剤を含有する組成物。【選択図】なし