METHOD FOR TREATING METAL SUBSTRATE INCLUDING PHOSPHONATE FUNCTIONALIZED LAYER, AND ARTICLE

To provide a method for treating a metal substrate including a phosphonate functionalized layer, and an article.SOLUTION: A method for treating a metal substrate comprises contacting a metal substrate including at least one of aluminum and aluminium alloy to a fluid to form a phosphonate functionalized layer on at least one area of the metal substrate. The fluid includes at least one of phosphonate containing acid and a derivative thereof; at least one of the phosphonate containing acid and the derivative thereof includes the pKa of a first acid proton; and the fluid having a pH of 5.5-8.5 and a pH larger by at least 0.5 pH than the pKa of the first acid proton includes at least one of the phosphonate containing acid of 0.1-20 mass% on the basis of the total weight of the fluid and the derivative thereof.SELECTED DRAWING: Figure 1 【課題】ホスホネート官能化層を含む金属基板処理方法および物品を提供する。【解決手段】金属基板処理方法は、アルミニウムおよびアルミニウム合金のうちの少なくとも１つを含む金属基板を流体と接触させて、金属基板の少なくとも１つの領域上にホスホネート官能化層を形成する。流体は、ホスホネート含有酸およびその誘導体のうちの少なくとも１つを含む。前記ホスホネート含有酸およびその誘導体のうちの少なくとも１つが、第１の酸性プロトンのｐＫａを含み、前記流体が、５．５～８．５の範囲であって、且つ、前記第１の酸性プロトンの前記ｐＫａよりも少なくとも０．５ｐＨ値大きいｐＨを含み、前記流体が、前記流体の総重量に基づいて、０．１重量パーセント～２０重量パーセントの前記ホスホネート含有酸およびその誘導体のうちの少なくとも１つを含む。【選択図】図１