POLISHING HEAD AND POLISHING DEVICE

To provide a polishing head capable of controlling a substrate polishing rate by preventing an edge of a polishing tape from unintentionally coming into contact with a substrate such as a wafer.SOLUTION: A polishing head 10 comprises a pressing mechanism 12 for pressing a polishing tape 2 against a...

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Bibliographische Detailangaben
Hauptverfasser:	FUJISAWA MAO, KASHIWAGI MAKOTO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a polishing head capable of controlling a substrate polishing rate by preventing an edge of a polishing tape from unintentionally coming into contact with a substrate such as a wafer.SOLUTION: A polishing head 10 comprises a pressing mechanism 12 for pressing a polishing tape 2 against a substrate W, and a tape hook 40 for limiting movement of an edge of the polishing tape 2 in the direction of being headed toward the substrate W. The tape hook 40 has a tape positioning surface 47 facing a polishing surface of the edge of the polishing tape 2.SELECTED DRAWING: Figure 1 【課題】研磨テープの縁部がウェーハなどの基板に意図せずに接触することを防止し、基板の研磨レートを制御できる研磨ヘッドを提供する。【解決手段】研磨ヘッド１０は、研磨テープ２を基板Ｗに対して押し付ける押圧機構１２と、基板Ｗに向かう方向への研磨テープ２の縁部の移動を制限するテープフック４０を備えている。テープフック４０は、研磨テープ２の縁部の研磨面に対向するテープ位置決め面４７を有する。【選択図】図１